Beyond Traditional Inspection:
One-stop Full-Scenario Defect Detection
2D/3D Optics
高精度定位及层间定位 3D 深度测量 2D 表面识别 2.5D层间定位 |
AIS光学视觉检测
定位系统
定位精度+0.5um/重复精度+0.3um
精准核验缺陷层位
动态误差补偿与大视野一致性通过动态补偿技术，确保在大视野检测下全局一致性，消除边缘形变干扰。
对缺陷，进行二次精准核验，精准判定缺陷所在层位，彻底排除误判、漏判
光谱共焦系统
光谱共焦系统
PMD系统
PMP系统
原始模式输入
包裹相位(x轴)
包裹相位(y轴)
绝对相位图
纳米级缺陷分析结果
突破像素级解析的精度局限，最终实现1.5um深度5um宽度微小缺陷的稳定检出
相位感知三维检测
采用计算重建技术，3-4秒即可完成8层缺陷检测。
Z轴精度0.5um
测量精度超越三坐标
500万像素检测<0.2秒
速度远超传统3D
全场百万坐标
2500万像素，300mm大视野
缺陷尺寸、深度、形态的精准测量覆盖亚微米级至毫米级多精度测量区间
多光融合，微米级「检测 + 测量」一体化
线扫系统
面阵系统
0.1~1mm 检测精度，毫米级缺陷精准捕捉
识别表面污染、微粒等低对比度
微米级尺寸、间距、位置度的精准测量
分辨率：16K单行超高分辨率，精准捕捉微米级颗粒
多角度结构光系统
多角度飞拍系统
反照率图
滤光影，还原材质
深度图
像素级高度
法线图
表面朝向与强度
梯度图
凸显边缘突变
检测精度达10~100μm，微米级缺陷精准捕捉
Three-dimensional positioning 3D Depth Measurement 2D Surface Inspection 2.5D Interlayer Positioning |
AIS光学视觉检测
Positioning System
Precise Verification of Defect Layer
Positioning Accuracy: ±0.5μm / Repeatability: ±0.3μm
Dynamic Error Compensation & Large Field-of-View (FOV) Consistency
Through dynamic compensation technology, ensure global consistency in large field-of-view inspection and eliminate edge deformation interference
Secondary precise verification of defects, accurately determine the defect layer, completely eliminate misjudgment and missed judgment
Auto Focus System
Spectral Confocal System
PMD System
PMP System
Raw Mode Input
X-axis
Y-axis
Absolute Phase Map
Nano-Level Defect Analysis Results
Breaks the pixel-level resolution limit, achieving stable detection of micro-defects with 1.5μm depth and 5μm width.
Phase-Sensing 3D Inspection
Adopts computational reconstruction technology, completing 8-layer defect inspection in just 3-4 seconds.
Z-axis Accuracy: 0.5μm,
Measurement Accuracy Surpasses CMM
5MP Inspection < 0.2s, Speed Far Exceeds Traditional 3D
Full-Field Million Coordinates, 25MP, 300mm Large Field of View
Accurate measurement of defect size, depth and morphology
Line Scan System
Area Scan System
Detection accuracy: 0.1~1 mm, precise capture of millimeter-level defects.
Identifies low-contrast, non-height defects such as surface contamination and particles
Precise measurement of micron-level dimensions, spacing and position
Resolution: 16K single-line ultra-high resolution
Precise capture of micron-level particles
Multi-angle Structured Light System
Multi-angle Flying Scan System
Albedo Map:
Filter shadows, restore material
Detection accuracy ranges from 10 to 100 μm, enabling precise capture of micron-level defects.
Normal Map:
Surface orientation and intensity
Depth Map:
Pixel-level height
Gradient Map:
Highlight edge abrupt changes
Multi-light Fusion: Micron-Level "Inspection + Measurement" Integration
High-precision positioning + 3D topography measurement + 2D surface dimension measurement + 2.5D interlayer parameter measurement, enabling structured and data-driven defect detection in all scenarios.
|
|
About Freesense
Company History
R&D and Manufacturing Base
Join Us
News Center
Contact Us
Contact Us CONTACT US
2D & 3D Optics
Battery Standard Testing
Electrical Signal Standard Testing
Product Center
Standard Software
Email: sale@freesense.com
Address: Building 9, No. 88 Jinhai Road, Pudong New Area, Shanghai, China
Tel: +86 21-62495999
Scan the QR Code to Follow Us